? semiconductor components industries, llc, 2016 november, 2016 ? rev. 4 1 publication order number: nz9f2v4/d nz9f2v4t5g, sznz9f2v4t5g series zener voltage regulators 250 mw sod?923 surface mount this series of zener diodes is packaged in a sod?923 surface mount package. they are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. they are well suited for applications such as cellular phones, hand held portables, and high density pc boards. specification features: ? standard zener breakdown voltage range ? 2.4 v to 24 v ? steady state power rating of 250 mw ? small body outline dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm) ? low body height: 0.016 (0.40 mm) ? esd rating of class 3 (>16 kv) per human body model ? sz prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant mechanical characteristics: case: void-free, transfer-molded, thermosetting plastic epoxy meets ul 94 v?0 lead finish: 100% matte sn (tin) mounting position: any qualified max reflow temperature: 260 c device meets msl 1 requirements maximum ratings rating symbol max unit total device dissipation fr?5 board, (note 1) @ t a = 25 c derate above 25 c p d 250 2.0 mw mw/ c thermal resistance from junction?to?ambient r ja 500 c/w junction and storage temperature range t j , t stg ?65 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. fr?4 minimum pad. 1 cathode 2 anode see specific marking information in the device marking column of the electrical characteristics tables starting on page 3 of this data sheet. device marking information www. onsemi.com device package shipping ? ordering information nz9fxxxxt5g, sznz9fxxxxt5g sod?923 (pb?free) 8000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification s brochure, brd8011/d. sod?923 case 514ab x = specific device code m = month code = pb?free package (note: microdot may be in either location) marking diagram x m 1 2 12
nz9f2v4t5g, sznz9f2v4t5g series www. onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted, v f = 0.9 v max. @ i f = 10 ma for all types) symbol parameter v z reverse zener voltage @ i zt i zt reverse current z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk i r reverse leakage current @ v r v r reverse voltage i f forward current v f forward voltage @ i f v z maximum temperature coefficient of v z c max. capacitance @v r = 0 and f = 1 mhz zener voltage regulator i f v i i r i zt v r v z v f temperature ( c) 25 0 100 40 20 0 power dissipation (%) 50 75 100 125 150 80 60 figure 1. steady state power derating
nz9f2v4t5g, sznz9f2v4t5g series www. onsemi.com 3 electrical characteristics (t a = 25 c unless otherwise noted, v f = 0.9 v max. @ i f = 10 ma for all types) device*** device marking zener voltage (note 1) zener impedance leakage current v z (mv/k) @ i zt c @ v r = 0 f = 1 mhz v z (volts) @ i zt z zt @ i zt z zk @ i zk i r @ v r min max ma ma a volts min max pf sz, nz9f2v4t5g j 2.28 2.52 5 100 1000 1 50 1 ?3.5 0 210 sz, nz9f2v7t5g e** 2.57 2.84 5 100 1000 1 20 1 ?3.5 0 210 sz, nz9f3v0t5g t** 2.85 3.15 5 100 1000 1 10 1 ?3.5 0 210 sz, NZ9F3V3T5G q 3.14 3.47 5 100 1000 1 10 1 ?3.5 0 210 sz, nz9f3v6t5g 3** 3.42 3.78 5 100 1000 1 10 1 ?3.5 0 210 sz, nz9f3v9t5g v** 3.71 4.10 5 100 1000 1 5 1 ?3.5 ?2.5 210 sz, nz9f4v3t5g y** 4.09 4.52 5 100 1000 1 5 1 ?3.5 0 210 sz, nz9f4v7t5g 3 4.47 4.94 5 100 800 0.5 2 1 ?3.5 0.2 150 sz, nz9f5v1t5g 4 4.85 5.36 5 80 500 0.5 2 1.5 ?2.7 1.2 130 sz, nz9f5v6t5g 5 5.32 5.88 5 60 200 0.5 1 2.5 ?2.0 2.5 115 sz, nz9f6v2t5g 6 5.89 6.51 5 60 100 0.5 1 3 0.4 3.7 110 sz, nz9f6v8t5g a* 6.46 7.14 5 40 60 0.5 0.5 3.5 1.2 4.5 105 sz, nz9f7v5t5g d* 7.13 7.88 5 30 60 0.5 0.5 4 2.5 5.3 100 sz, nz9f8v2t5g e* 7.79 8.61 5 30 60 0.5 0.5 5 3.2 6.2 90 sz, nz9f9v1t5g f* 8.65 9.56 5 30 60 0.5 0.5 6 3.8 7 80 sz, nz9f10vt5g j* 9.50 10.50 5 30 60 0.5 0.1 7 4.5 8 80 sz, nz9f11vt5g k* 10.45 11.55 5 30 60 0.5 0.1 8 5.4 9 80 sz, nz9f12vt5g l* 11.40 12.60 5 30 80 0.5 0.1 9 6 10 80 sz, nz9f13vt5g p* 12.35 13.65 5 37 80 0.5 0.1 10 7 11 75 sz, nz9f15vt5g q* 14.25 15.75 5 42 80 0.5 0.1 11 9.2 13 70 sz, nz9f16vt5g r* 15.20 16.80 5 50 80 0.5 0.1 12 10.4 14 65 sz, nz9f18vt5g t* 17.10 18.90 5 50 80 0.5 0.1 14 12.4 16 60 sz, nz9f20vt5g v* 19.00 21.00 5 55 100 0.5 0.1 15.4 14.4 18 55 sz, nz9f22vt5g y* 20.90 23.10 5 55 100 0.5 0.1 16.8 15.4 20 55 sz, nz9f24vt5g f 22.80 25.20 5 70 120 0.5 0.1 18.9 16.8 22 50 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. *rotated 90 . **rotated 270 . ***sz prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable. 1. zener voltage is measured with a pulse test current i z at an ambient temperature of 25 c.
nz9f2v4t5g, sznz9f2v4t5g series www. onsemi.com 4 package dimensions sod?923 case 514ab issue c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, protrusions, or gate burrs. dim min nom max millimeters a 0.34 0.37 0.40 b 0.15 0.20 0.25 c 0.07 0.12 0.17 d 0.75 0.80 0.85 e 0.55 0.60 0.65 0.95 1.00 1.05 l 0.19 ref h e 0.013 0.015 0.016 0.006 0.008 0.010 0.003 0.005 0.007 0.030 0.031 0.033 0.022 0.024 0.026 0.037 0.039 0.041 0.007 ref min nom max inches d e c a ?y? ?x? 2 1 dimensions: millimeters *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* see application note and8455/d for more mounting details 1.20 2x 0.25 2x 0.36 package outline b 2x 0.08 xy top view h e side view 2x bottom view l2 l 2x l2 0.05 0.10 0.15 0.002 0.004 0.006 on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 nz9f2v4/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
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